Monomer for binding nano-metal, conductive polymer composite and method of preparing the conductive polymer composite

ABSTRACT

A monomer for binding nano-metal, which is useful for the preparation of a conductor having increased conductivity with ensuring flexibility and transparency. Polymerization of the monomer for binding nano-metal provides a conductive polymer composite including a nano-metal rod. A method of preparing the conductive polymer composite is also provided.

This non-provisional application claims priority to Korean PatentApplication No. 10-2008-0044482, filed on May 24, 2008, and all thebenefits accruing therefrom under U.S.C. §119, the contents of which areincorporated herein by reference in their entirety.

BACKGROUND

1. Field

This disclosure is directed to a monomer for binding nano-metal, aconductive polymer composite and a method of preparing the conductivepolymer composite, and more particularly, to a monomer for bindingnano-metal for use in the preparation of a conductive polymer compositeincluding a nano-metal rod, to a conductive polymer composite, and to amethod of preparing the conductive polymer composite.

2. Description of the Related Art

Conductive polymers generally have a π-conjugated structure, where suchconductive polymers exhibit the properties of a conductor due todelocalization of electron density within the polymer chain from dopingto create a delocalizable charge (positive or negative), where thepresence of delocalized charge increases electrical conductivity. Dopedconductive polymers may have metallic properties, making it possible touse them as agents for blocking (absorbing) electromagnetic waves, asantistatic agents, and as electrodes.

Compared to inorganic semiconductors, such as those based on silicon,electronic devices which use polymers are advantageous in that thefabrication process is very simple, the fabrication cost is low, andvarious substrates, including different kinds of plastics, can be used.Further, because the electronic energy structure and energy band gap ofpolymer semiconductors may be readily adjusted by molecular design andcontrol of polymer properties, the use of polymer semiconductors asnovel materials is desirable.

Conductive polymers advantageously are mechanically flexible and arecapable of being printed upon by a printing process, which is desirable.Where conductive polymers are doped in order to impart electricalconductivity, drawbacks such as decreased polymer solubility and lighttransmittance may occur. And, while the solubility of conductivepolymers may be increased, electrical conductivity tends to decreaserelative to similar polymer materials that are unmodified.

SUMMARY

Accordingly, there is a continuous need for the development ofconductive polymers which can ensure not only high electricalconductivity but also high solubility and light transmittance.

Disclosed herein is, in an embodiment, a monomer for binding nano-metal,for the preparation of a conductive polymer composite having highconductivity while ensuring transparency and flexibility.

Also disclosed herein is, in an embodiment, a conductive polymercomposite having high conductivity while ensuring transparency andflexibility.

Also disclosed herein is, in an embodiment, a method of preparing theconductive polymer composite.

In a specific embodiment, a monomer for binding nano-metal, representedby Formula 1 below, is provided:Ar-L₁-A  [Formula 1]

wherein Ar is a thiophenyl, anilinyl, pyrrolyl, furanyl, pyrazolyl,carbazolyl, fluorenyl or a derivative thereof, L₁ is a C_(1˜10) alkylenegroup containing one or more heteroatoms selected from the groupconsisting of S, O, N and Si; a C_(1˜10) alkyleneoxy group containingone or more hetero atoms selected from the group consisting of S, O andN; or a C_(1˜10) silyleneoxy group containing one or more hetero atomsselected from the group consisting of S, O and N; and A is —SH, —COOH,—SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, or trichlorosilyl.

In another specific embodiment, a conductive polymer composite includinga nano-metal rod is provided, wherein the surface of the nano-metal rodis bound with the monomer for binding nano-metal, as represented byFormula 1, and to which conjugated conductive polymer monomers arejoined.

In a further specific embodiment, a method of preparing the conductivepolymer composite is provided, the method including (a) binding themonomer for binding nano-metal, as represented by Formula 1, to thesurface of a nano-metal rod, thus forming a nano-metal-bound monomer;and (b) mixing the nano-metal-bound monomer formed in (a), a conductivepolymer monomer, a polymerization initiator, and a dopant with asolvent, to obtain a mixture, and then subjecting the mixture to heatingand polymerization.

BRIEF DESCRIPTION OF THE DRAWINGS

The exemplary embodiments will be more clearly understood from thefollowing detailed description taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is an H¹-NMR spectrum of an exemplary monomer for bindingnano-metal, synthesized in the Example;

FIG. 2 is a scanning electron micrograph of an exemplary nano-metal rod,obtained in the Example;

FIG. 3 is a voltage-current graph of the exemplary nano-metal rod,obtained in the Example;

FIG. 4 is a voltage-current graph of an exemplary nano-metal-boundmonomer, obtained in the Example; and

FIG. 5 is a graph of light transmittance of an exemplary conductivepolymer composite, synthesized in the Example.

DETAILED DESCRIPTION

Hereinafter, a detailed description of a monomer for binding nano-metal,a conductive polymer composite, and a method of preparing the conductivepolymer composite are provided according to exemplary embodiments.

In an embodiment, a novel monomer for binding nano-metal is provided.The monomer for binding nano-metal may be used for the preparation of aconductive polymer composite including a nano-metal rod.

The monomer for binding nano-metal is represented by Formula 1 below.Ar-L₁-A  [Formula 1]

wherein Ar is thiophenyl, anilinyl, pyrrolyl, furanyl, pyrazolyl,carbazolyl, fluorenyl or derivatives thereof, L₁ is a C_(1˜10) alkylenegroup containing one or more heteroatoms selected from the groupconsisting of S, O, N and Si; a C_(1˜10) alkyleneoxy group containingone or more hetero atoms selected from the group consisting of S, O andN; or a C_(1˜10) silyleneoxy group containing one or more heteroatomsselected from the group consisting of S, O and N; and A is —SH, —COOH,—SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, or trichlorosilyl.

Examples of the monomer for binding nano-metal, as represented byFormula 1, include, but are not limited to, monomers for bindingnano-metal represented by Formulas 2 to 6 below.

The monomer for binding nano-metal, represented by Formula 1, may beprepared by dissolving as reaction starting materials a first reactivecompound comprising thiophenyl, anilinyl, pyrrolyl, furanyl, pyrazolyl,carbazolyl, fluorenyl or derivatives thereof; a second reactive compoundcomprising a C_(1˜10) alkylene group, a C_(1˜10) alkyleneoxy group or aC_(1˜10) silyleneoxy group, containing one or more hetero atoms with—SH, —COOH, —SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, or trichlorosilyl; andn,n′-dimethyl-4-aminopyridine (“4-DMAP”) as a catalyst in a solvent,mixing them at 0 to 100° C. under a nitrogen atmosphere, adding areagent (such as, for example, a dehydrating agent), reacting themixture for 4 to 16 hours, filtering the resulting reaction solution,washing the reaction solution, drying to remove the remaining solvent toafford a crude product, repeatedly performing precipitation and solventwashing of the crude product, and performing purification of theprecipitated, partially purified product by crystallization,chromatography, sublimation, or other method, and thereby obtaining apure monomer material.

In another embodiment, a conductive polymer composite using the monomerfor binding nano-metal mentioned above is provided.

The conductive polymer composite includes a nano-metal rod, wherein thesurface of the nano-metal rod has bound to it the monomer for bindingnano-metal, to which conjugated conductive polymer monomers are joined.

The conductive polymer composite is prepared by attaching the monomerfor binding nano-metal to the nano-metal rod to thus form anano-metal-bound monomer, mixing the nano-metal-bound monomer with aconductive polymer monomer, and then polymerizing the mixture.

The conductive polymer composite including the nano-metal rod, therebyhas much higher electrical conductivity than typical conductivepolymers, and further, has transparency and flexibility propertiescomparable to those of conductive polymers, and is thus capable of beingused for flexible devices. Also, a device may be fabricated through aprinting process, as an example of a solution process, thereby conveyingprocess advantages. Furthermore, because the conductive polymercomposite is transparent, it is capable of being utilized in variousdisplays.

The polymer moiety of the conductive polymer composite has a conjugatedstructure of alternating single and double carbon-carbon bonds toprovide a delocalized π-electron structure. Accordingly, when the energyband gap of the conductive polymer composite is decreased with the useof a dopant, electrical charges are allowed to move in the conductivepolymer. Further, because the conductive polymer composite includes thenano-metal rod, electrical conductivity can be further increasedcompared to when only a conductive polymer is used.

Further, —SH, —COOH, —SOOH, —CN, —CH₂═CH₂, —C≡CH, or trichlorosilyl,located at an end of the monomer of Formula 1, is bound to the surfaceof the nano-metal rod.

The nano-metal is conductive metal, and examples thereof include, butare not limited to, gold (Au), copper (Cu), silver (Ag), platinum (Pt),aluminum (Al), indium (In), tin (Sn), iron (Fe), nickel (Ni), lead (Pb),zinc (Zn), mercury (Hg), palladium (Pd), and alloys thereof.

The nano-metal rod has a diameter of from about 1 nm to about 500 nm anda length of from about 1 μm to about 100 μm. The ratio of diameter tolength is from about 1:1 to about 1:10⁶.

Examples of the conductive polymer monomer useful for the polymerizationof the conductive polymer composite include 3,4-ethylenedioxythiophene,thiophene, aniline, pyrrole, vinylcarbazole, acetylene, pyridine,azulene, indole, phenylacetylene (to provide phenylenevinylene),1,4-substituted benzenes (to provide phenylene),2-methoxy-5-(2′-ethyl)hexyloxy-p-phenylacetylene (to provide thecorresponding phenylenevinylene), 2-thiophenylacetylene (to provide2-thienylenevinylene), azines, quinones, phenylmercaptan (to providephenylene sulfide), furan, isothianaphthene, and derivatives thereof.

In a further embodiment, a method of preparing the conductive polymercomposite is provided. In the preparation method, the monomer forbinding nano-metal is attached to the nano-metal rod, thus preparing anano-metal-bound monomer, after which the nano-metal-bound monomer ispolymerized with a conductive polymer monomer, finally obtaining aconductive polymer composite. In the polymerization procedure, a dopantis provided together with the monomers, so that doping is conducted atthe same time as polymerization, thus preparing the conductive polymercomposite. In this way, the preparation and application of theconductive polymer composite become easier.

Specifically, the method of preparing the conductive polymer compositeincludes (a) attaching the monomer for binding nano-metal, representedby Formula 1 below, to the surface of the nano-metal rod, thus formingthe nano-metal-bound monomer; and (b) mixing the nano-metal-boundmonomer formed in (a), the conductive polymer monomer, a polymerizationinitiator, and a dopant with a solvent, and then performing heating andpolymerization.Ar-L₁-A  [Formula 1]

wherein Ar is thiophenyl, anilinyl, pyrrolyl, furanyl, pyrazolyl,carbazolyl, fluorenyl or derivatives thereof; L₁ is a C_(1˜10) alkylenegroup containing one or more hetero atoms selected from the groupconsisting of S, O, N and Si, a C_(1˜10) alkyleneoxy group containingone or more hetero atoms selected from the group consisting of S, O andN, or a C_(1˜10) silyleneoxy group containing one or more hetero atomsselected from the group consisting of S, O and N; and A is —SH, —COOH,—SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, or trichlorosilyl.

In (a), the process of attaching the monomer for binding nano-metal tothe nano-metal rod is not particularly limited.

For example, because —SH, —COOH, —SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, ortrichlorosilyl, which is located at an end of the monomer for bindingnano-metal, as represented by Formula 1, has high bindability withmetal, merely by mixing the monomer for binding nano-metal and thenano-metal rod in the solvent, the bond between the nano-metal and themonomer is formed. Examples of the solvent useful in the exemplaryembodiments include dimethylformamide (“DMF”), isopropyl alcohol,tetrahydrofuran (“THF”), benzene, toluene, methanol, ethanol, andN-methylpyrrolidone (“NMP”), which may be used alone or in mixturesthereof.

Examples of the monomer for binding nano-metal, represented by Formula1, which may be used in the preparation method, include, but are notlimited to, monomers represented by Formulas 2 to 6 below.

The nano-metal used in the preparation method is conductive metal, andexamples thereof include, but are not limited to, gold (Au), copper(Cu), silver (Ag), platinum (Pt), aluminum (Al), indium (In), tin (Sn),iron (Fe), nickel (Ni), lead (Pb), zinc (Zn), mercury (Hg), palladium(Pd), and alloys thereof.

Examples of the conductive polymer monomer include, but are not limitedto, 3,4-ethylenedioxythiophene, thiophene, aniline, pyrrole,vinylcarbazole, acetylene, pyridine, azulene, indole, phenylacetylene,substituted benzene, azines, quinone, phenylmercaptan, furan,isothianaphthene, and derivatives thereof.

Examples of the polymerization initiator useful in the polymerizationprocedure include, but are not limited to, ferric (III) p-toluenesulfonate (“FTS”), and ferric (III) chloride (FeCl₃). Examples of thedopant include, but are not limited to, p-toluene sulfonic acid,polystyrene sulfonic acid, salts of sulfonic acid and metal, such aslithium polystyrene sulfonate, lithium p-toluene sulfonate, poly(styreneammonium sulfonate), ammonium p-toluene sulfonate, sodium polystyrenesulfonate, sodium p-toluene sulfonate, poly(styrene potassiumsulfonate), and potassium p-toluene sulfonate, and combinations thereof.Any dopant may be used without limitation as long as it is typical inthe art. In the case of ferric (III) p-toluene sulfonate (FTS), itfunctions not only as a polymerization initiator but also as a dopant,thus decreasing the energy band gap of the polymer, thereby impartingconductivity to the polymer.

In (b), the molar ratio of the conductive polymer monomer to thepolymerization initiator is from 1:1 to 1:3. The nano-metal rod is addedto the conductive polymer monomer solution, stirred, added with apolymerization initiator, and stirred, thereby obtaining a mixturesolution, after which the mixture solution is applied on the uppersurface of a predetermined substrate, and is then heated andpolymerized, thereby obtaining a desired conductive polymer composite.Alternatively, after polymerization, spin coating may be performed.Hence, the process of producing the conductive polymer composite film isnot particularly limited, and the form thereof is not necessarilylimited to film.

In addition, in (b), a mixture catalyst may be further added. An exampleof the mixture catalyst is imidazole. In the case where FTS is used as apolymerization initiator, FTS is a strong oxidizer and thus can functionto rapidly polymerize the conductive polymer monomer even at roomtemperature. As such, imidazole plays a role as a polymerizationinhibitor for adjusting the polymerization rate in order to ensuretransparency.

In accordance with still a further embodiment, a device including theconductive polymer composite is provided. The conductive polymercomposite including the nano-metal rod has high conductivity andsuperior processability, such as flexibility and transparency, and maythus be fabricated in part by a solution process, for readyprocessability. The conductive polymer composite may be applied totransparent electrodes for various displays, electrodes for solar cells,films for removing static electricity and blocking harmfulelectromagnetic waves, circuits, cells, electrodes for light sources,electrochromic devices, sensors, films for blocking electromagneticwaves requiring light transmittance, touch panels, wire electrodes,terminal electrodes for transistors, and antennas and chips for RadioFrequency Identification (“RFID”) tags. In this way, the conductivepolymer composite may substitute for some conventional metal electrodesand may be used as an alternative to ITO electrodes, and may thus beutilized for flexible devices.

In addition, the conductive polymer composite according to the exemplaryembodiments is blended with a general polymer and thus may be morevariously applied. Typically, conductive polymers have a negligibledifference in electrical conductivity when used in an amount higher thana predetermined level. For example, polyaniline doped with a transparentelectrode is blended withpoly[2-methoxy-5-(2′-ethyl-hexyloxy)-1,4-phenylene vinylene] (“MEH-PPV”)as a light-emitting layer and thus may be used as a flexible lightsource. The p-type polymer (MEH-PPV) may be blended with the n-typepolymer cyano polyphenylene vinylene (“CN-PPV”) or doped with afullerene (e.g., C₆₀), and thus may be used as a light-receiving device.Moreover, the conductive polymer composite may be applied to naturalcolor electroluminescent displays using a polymer thin film, channelmaterials in polymer field effect transistors (“FETs”), polymersecondary cells, having high output and capacity per unit weight, filmsfor preventing the corrosion of metal, accumulators of electricity,nonlinear optical devices, and electronic devices on a molecular scale.

A better understanding of the exemplary embodiments will be described inmore detail with reference to the following examples. However, theseexamples are given merely for the purpose of illustration, and shouldnot to be construed as limiting the scope of the embodiments.

EXAMPLE (A) Synthesis of Monomer for Binding Nano-Metal

As shown in Reaction 1, 2-(thiophene-3-yl)acetic acid) (1 g, 7.03 mmol),propane-1,3-dithiol (0.753 g, 7.03 mmol), and 4-dimethylaminopyridine(4-DMAP) (2.014 g, 1.75 mol) were dissolved in 80 ml of methylenechloride in a three-neck round bottom flask, after which stirring wasperformed at 60° C. in a nitrogen atmosphere. The stirred mixturesolution was slowly added with N,N′-dicyclohexylcarbodiimide (DCC) (2.89g, 14.06 mol) dissolved in 20 ml of methylene chloride, and was thenallowed to react for 9 hours. The reaction solution was washed usingsaturated aqueous Na₂CO₃, dried over MgSO₄, and filtered. The remainingsolvent was removed by rotary evaporation to obtain a yellowishsolution. This solution was diluted with acetone, and cooled to 0° C.,to obtain residual 1,3-dicyclohexylurea (“DCU”) as a precipitate. Thisprecipitate was removed by filtration through a paper filter, andaddition of acetone and removal of the DCU precipitate were repeateduntil DCU precipitate was no longer evident in the solution. Finally,the remaining solvent was removed by rotary evaporation, and the crudepurified using a silica column eluted with a solution of methylenechloride and methanol (60:1 v/v), thereby producing after collection ofthe fractions and removal of the solvent,S-3-mercaptopropyl-2-(thiophene-3-yl)ethanethioate (“MTE”) (the monomer)as a pure yellow compound. The characteristic H¹-NMR spectrum (inacetone-d₆) of the product is shown in FIG. 1.

(B) Formation of Nano-Metal Rod

(i) Vacuum Evaporation of Copper on Surface of Anodic Aluminum Oxide(“AAO”)

Copper was first deposited on a surface of a porous anodic aluminumoxide (AAO) filter. An AAO filter itself is nonconductive, it wasnecessary to modify a surface of the AAO to be electrically conductiveso that electroplating could be performed in the AAO. Thus, using athermal evaporator system (GVC 2000, available from SNT in Korea), acurrent of 180 Amperes was applied, and copper was vacuum evaporated onone surface of the AAO for 15 min, thereby providing a conductive AAO.

(ii) Electroplating

After the formation of the Cu/AAO electrode, copper was furtherelectroplated once in AAO using 1 M CuSO₄ to provide a surface for anano-gold rod to be grown, and to create a separation layer. UsingPARSTAT 2263 (Princeton Applied Research, USA), a constant voltage of−0.05 V was applied until a total charge of 1.5 C·cm⁻² had flow. Amixture solution of 40 g/l KAu(CN)₂ and 100 g/l KH₂PO₄ was loaded in theAAO, and constant voltage of −1.0 V was applied, thereby electroplatinggold into the pores of the AAO nanopores.

During electroplating, the Cu/AAO electrode was used as a workingelectrode, a platinum plate provided the counter electrode, and Ag/AgCl(KCl saturated solution) was used as a reference electrode.

(iii) Removal of Copper and AAO

The Au/Cu/AAO plated filter thus obtained was immersed in a 6 M HNO₃aqueous solution for 3 hours to remove copper, and washed with DI water,and the Au/AAO was then immersed in a 3 M NaOH aqueous solution for 3hours or longer, to dissolve and remove the AAO. The nano-gold rods(which had been deposited in the pores of the AAO filter) thus obtainedwas washed with deionized (“DI”) water.

The diameter of the nano-gold rod was about 250 to about 300 nm, and thelength thereof was about 25 to about 30 μm. A scanning electronmicrograph (“SEM”) showing the resulting nano-gold rods is shown in FIG.2.

(C) Synthesis of Nano-Metal-Bound Monomer and Conductive PolymerComposite

As an initiator of poly(3,4-ethylendioxythiophene) (“PEDOT”), which is aconductive polymer, ferric (III) p-toluene sulfonate (“FTS”) was used asan initiator, and the molar ratio of the 3,4-ethylenedioxythiophene(“EDOT”) monomer to the initiator was set to 1:2.33. Using FTS, which isa strong oxidant, the polymerization of EDOT occurred rapidly, even atroom temperature. Imidazole was used as a polymerization inhibitor toadjust the polymerization rate and to ensure transparency. The molarratio of EDOT to imidiazole was set at 1:2. In the reaction, the EDOTand imidazole were first each diluted to 10 wt % with 2-propanol,respectively, and then mixed together. To the mixture solution was addedthe nano-gold rods, and the resulting mixture solution mixed bysonicating for 30 min. FTS was then added, and mixing continued for anadditional 30 min. The mixture solution was dropped onto a polyethyleneterephthalate (“PET”) film substrate, and was then uniformly appliedover the surface of the substrate using a spin coater. The coatedsubstrate was polymerized at 120° C. for 1 hour, washed with ethanol,and dried, to thereby obtain a nano-gold rod/PEDOT composite film.

To confirm the bond between the nano-gold rod and the monomer, thenano-gold rod before reaction and the nano-metal-bound monomer afterreaction were each measured for voltage-current relation by cyclicvoltametry (“CV”) to determine the individual oxidation-reductionpotentials. The results are shown in FIGS. 3 and 4.

With reference to FIGS. 3 and 4, in the nano-gold rod before reaction(FIG. 3), oxidation and reduction states were separate, but in thenano-metal-bound monomer after reaction (FIG. 4, “After”), oxidation andreduction states could be seen to disappear. The, the monomer wasthereby confirmed to have been bound to the nano-gold rod (which acts asthe predominant conductor in the solution) to thus constitute thesurface thereof.

Evaluation of Properties

The conductivity, sheet resistance, and light transmittance of theconductive polymer composite including the nano-gold rod obtained inExample were measured. For comparison, a PEDOT(Poly(3,4-ethylenedioxythiophene)) thin film was used, which wasprepared by dropping a mixture solution of EDOT and FTS in a molar ratioof 1:2.33 on a PET film substrate, uniformly applying it on thesubstrate using a spin coater, polymerizing the coated substrate at 120°C. for 1 hour, washing the substrate using ethanol, and drying it.

Experimental Example 1 Measurement of Conductivity and Sheet Resistance

The conductive polymer composite (D) including the nano-gold rodobtained in Example and the comparative conductive polymer were measuredfor conductivity using a van der Pauw 4-point probe method, and theconductivity measured was used to calculate sheet resistance. Theresults are shown in Table 1 below.

Experimental Example 2 Measurement of Light Transmittance

The conductive polymer composite (D) including the nano-gold rodobtained in Example and the comparative conductive polymer were measuredfor light transmittance at 550 nm using a UV-vis spectrophotometer. Theresults are shown in Table 1 and FIG. 5.

TABLE 1 Conductivity Sheet Resistance Light Transmittance (S/cm)(Ω/square) (%) Example 800 100 85 C. Example 350 400 85

As is apparent from Table 1 and FIG. 5, the conductivity of theconductive polymer composite (D) including the nano-gold rod (Example inTable 1) was determined to be 800 S/cm, which is much higher than thatof the PEDOT (C. Example in Table 1). Further, light transmittance wasmaintained at 80% or higher, and sheet resistance decreased to a levelof less than 200 Ω/square. Accordingly, the exemplary conductive polymercomposite can substitute for conventional metal electrodes of variousdevices, unlike conventional conductive polymer material. The exemplarymaterial is a polymer obtained by binding a conductive polymer monomerto metal having high conductivity and then polymerizing the monomer, andis grown in a non-directional form on the metal. Compared to aconventional conductive polymer-conductor mixture form, the exemplaryconductive polymer composite exhibits very high conductivity, and thuslow sheet resistance. This is believed to occur because the nano-metalconductive polymer composite has a form in which contact resistance withmetal is minimized. Further, the metal is present in nano-size, and isdispersed well, thereby preventing a decrease in light transmittance.

Although Exemplary embodiments have been disclosed for illustrativepurposes, those skilled in the art will appreciate that variousmodifications, additions and substitutions are possible, withoutdeparting from the scope and spirit of the invention as disclosed in theaccompanying claims.

What is claimed is:
 1. A conductive polymer composite consisting of anano-metal rod, wherein a surface of the nano-metal rod is bound with amonomer for binding nano-metal, represented by Formula 1 below, to whichconjugated conductive polymer monomers are joined:Ar-L₁-A  [Formula 1] wherein Ar is thiophenyl, anilinyl, pyrrolyl,furanyl, pyrazolyl, carbazolyl, fluorenyl or derivatives thereof, L₁ isa C_(1˜10) alkylene group containing one or more hetero atoms selectedfrom the group consisting of S, O, N and Si; a C_(1˜10) alkyleneoxygroup containing one or more hetero atoms selected from the groupconsisting of S, O and N; or a C_(1˜10) silyleneoxy group containing oneor more hetero atoms selected from the group consisting of S, O and N;and A is —SH, —COOH, —SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, ortrichlorosilyl.
 2. The conductive polymer composite of claim 1, whereinthe monomer for binding nano-metal is represented by Formulas 2 to 6below:


3. The conductive polymer composite of claim 1, wherein —SH, —COOH,—SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, or trichlorosilyl, located at an endof the monomer for binding nano-metal, is bound to the surface of thenano-metal rod.
 4. The conductive polymer composite of claim 1, whereinthe nano-metal is selected from the group consisting of gold, copper,silver, platinum, aluminum, indium, tin, iron, nickel, lead, zinc,mercury, palladium, and alloys thereof.
 5. The conductive polymercomposite of claim 1, wherein the nano-metal rod has a diameter of fromabout 1 nm to about 500 nm and a length of from about 1 μm to about 100μm.
 6. The conductive polymer composite of claim 1, wherein theconductive polymer monomer is selected from the group consisting of3,4-ethylenedioxythiophene, thiophene, aniline, pyrrole, vinylcarbazole,acetylene, pyridine, azulene, indole, phenylacetylene, 1,4-substitutedbenzene, azine, quinone, phenylmercaptan, furan, isothianaphthene, andderivatives thereof.
 7. A method of preparing a conductive polymercomposite, comprising: (a) binding a monomer for binding nano-metal,represented by Formula 1 below, to a surface of a nano-metal rod, thusforming a nano-metal-bound monomer; and (b) mixing the nano-metal-boundmonomer formed in (a), a conductive polymer monomer, a polymerizationinitiator, and a dopant with a solvent, to obtain a mixture, and thensubjecting the mixture to heating and polymerization, wherein theconductive polymer composite consists of a nano-metal rod, wherein asurface of the nano-metal rod is bound with a monomer for bindingnano-metal, represented by Formula 1 below, to which conjugatedconductive polymer monomers are joined:Ar-L₁-A  [Formula 1] wherein Ar is thiophenyl, anilinyl, pyrrolyl,furanyl, pyrazolyl, carbazolyl, fluorenyl or derivatives thereof, L₁ isa C_(1˜10) alkylene group containing one or more hetero atoms selectedfrom the group consisting of S, O, N and Si; a C_(1˜10) alkyleneoxygroup containing one or more hetero atoms selected from the groupconsisting of S, O and N; or a C_(1˜10) silyleneoxy group containing oneor more hetero atoms selected from the group consisting of S, O and N;and A is —SH, —COOH, —SOOH, —CN, —CH₂═CH₂, —C≡CH, —NH₂, ortrichlorosilyl.
 8. The method of claim 7, wherein the monomer forbinding nano-metal, is represented by Formulas 2 to 6 below:


9. The method of claim 7, wherein the nano-metal is selected from agroup consisting of gold, copper, silver, platinum, aluminum, indium,tin, iron, nickel, lead, zinc, mercury, palladium, and alloys thereof.10. The method of claim 7, wherein the conductive polymer monomer isselected from a group consisting of 3,4-ethylenedioxythiophene,thiophene, aniline, pyrrole, vinylcarbazole, acetylene, pyridine,azulene, indole, phenylenevinylene, phenylene, azine, quinone, phenylenesulfide, furan, isothianaphthene, and derivatives thereof.
 11. Themethod of claim 7, wherein the (b) further comprises mixing a mixturecatalyst.
 12. A device comprising the conductive polymer composite ofclaim
 1. 13. A conductive polymer composite comprising a nano-metal rod,wherein a surface of the nano-metal rod is bound with a monomer forbinding nano-metal, represented by Formulas 2 to 6 below, to whichconjugated conductive polymer monomers are joined:


14. A method of preparing a conductive polymer composite, comprising:(a) binding a monomer for binding nano-metal, represented by Formulas 2to 6 below, to a surface of a nano-metal rod, thus forming anano-metal-bound monomer; and (b) mixing the nano-metal-bound monomerformed in (a), a conductive polymer monomer, a polymerization initiator,and a dopant with a solvent, to obtain a mixture, and then subjectingthe mixture to heating and polymerization: